Mechanical standardization of semiconductor devices-general rules for the preparation of outline drawings of surface mounted semiconductor device packages-design guide for glass sealed ceramic quad flatpack 半導(dǎo)體器件的機(jī)械標(biāo)準(zhǔn)化.表面安裝半導(dǎo)體器件封裝外形圖繪制一般規(guī)則.玻璃密封陶瓷方型扁平封裝設(shè)計(jì)指南
G-qfp mechanical standardization of semiconductor devices-part 6-8 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages-design guide for glass sealed ceramic quad flatpack 半導(dǎo)體器件的機(jī)械標(biāo)準(zhǔn)化.第6-8部分:半導(dǎo)體器件包裝用表面安裝略圖制備的一般規(guī)則.玻璃密封的陶瓷四方塊的設(shè)計(jì)指南
G-qfp mechanical standardization of semiconductor devices-part 6-8 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages; design guide for glass sealed ceramic quad flatpack 半導(dǎo)體器件的機(jī)械標(biāo)準(zhǔn)化.第6-8部分:表面安裝半導(dǎo)體器件封裝外形圖繪制的一般規(guī)則.玻璃密封的陶瓷四邊形扁平組件的設(shè)計(jì)指南