High power laser diode array is mainly used as the pumping energy source for solid state laser 大功率激光器陣列的重要應(yīng)用是泵浦固體激光器。
There is the need for high duty - cycle laser diode array to satisfy the demand the dpssl ( diode pumping solid state laser ) technology 要滿足當(dāng)前的泵浦要求,高占空比大功率激光器陣列是必需的泵浦源。
Based on computer , laser modulation , fiber coupling and microlens focusing technology , fiber coupled laser diode array is researched 摘要采用計(jì)算機(jī)控制技術(shù)、激光器調(diào)制技術(shù)、光纖耦合技術(shù)、微透鏡聚焦技術(shù),研究了半導(dǎo)體激光器的線陣。
So largely developing high power laser diode array is meaningful for the fast development of economy , the modernization of national defend and the promotion of people ' s life 加大力度發(fā)展大功率激光器,對(duì)于經(jīng)濟(jì)建設(shè)的飛速發(fā)展,國(guó)防建設(shè)的現(xiàn)代化,以及人民生活水平的提高都有著重要的意義。
Principle and processing of laser diode array is shown with the simply array combination , extending the application of laser array in rapid prototyping ( rp ) and laser display technology 利用線陣組合原理展示了半導(dǎo)體激光器線陣技術(shù)的原理和實(shí)現(xiàn)過(guò)程,擴(kuò)展了線陣技術(shù)在快速成型、顯示技術(shù)等方面的應(yīng)用領(lǐng)域。
At last , through calculation we get the two dimensional temperature distribution of the chip and the submount of a high power laser diode array , which are consistent with the test data 最后,通過(guò)實(shí)驗(yàn)測(cè)定激光器陣列有源區(qū)的溫升,得到與理論計(jì)算基本一致的實(shí)驗(yàn)數(shù)據(jù),并且對(duì)溫度的數(shù)值計(jì)算做了進(jìn)一步的討論。
The tapered and semi - tapered fiber can be arranged in line or array , which has the wide application to the laser diode pumping solid state laser and the power outputting of the high - power laser diode array 這種錐形和半錐形光纖耦合系統(tǒng)可以方便的排成線陣或陣列,在二極管激光器泵浦固體激光器的泵浦光源輸出、大功率半導(dǎo)體激光器陣列的光功率輸出都有重要的應(yīng)用價(jià)值。
Based on a 3 - d transient thermal model with inhomogeneous heat generation , the temperature and thermal stress distribution in the disk of heat capacity laser pumped by high power laser diode array ( lda ) are simulated and analyzed by means of finite element methods 摘要為了研究激光介質(zhì)熱畸變對(duì)固體熱容激光器的影響,數(shù)值計(jì)算了高功率激光二極管陣列抽運(yùn)片狀激光介質(zhì)的瞬態(tài)溫度場(chǎng)和熱應(yīng)力分布。
Then after analyzing the heat conduction in laser diode array , we simply simulate the transient thermal behavior of high power laser diode array and build a two dimensional static model of temperature distribution of it by fem ( finite element method ) 接著分析激光器陣列中熱的傳導(dǎo),簡(jiǎn)單的模擬工作工程中瞬態(tài)溫度的變化。然后通過(guò)有限元分析法,建立二維溫態(tài)分布,得到穩(wěn)態(tài)工作時(shí),大功率激光器陣列中芯片和載體的溫度的空間分布。
Moreover , we give a further discussion on the numerical value calculation of temperature distribution . the main problem when we design the high duty - cycle high power laser diode array we face is the large amount of heat during its operation . so we change the proportion of some ingredients and the concentration of the dopage to gain high quality iii - v material 在激光器陣列的設(shè)計(jì)過(guò)程中,針對(duì)大功率激光器嚴(yán)重的產(chǎn)熱問(wèn)題,尤其是高占空比工作時(shí),會(huì)有更多的功率轉(zhuǎn)化為熱的現(xiàn)象,我們改進(jìn)芯片材料的配比、摻雜,提出適應(yīng)高占空比工作的器件版圖結(jié)構(gòu)。