rigid multilayer printed board造句
例句與造句
- Harmonized system of quality assessment for electronic components - capability detail specification : flex - rigid multilayer printed boards with through connections
電子元器件用質(zhì)量評(píng)估協(xié)調(diào)體系.性能詳細(xì)規(guī)范:整體連接彎曲剛性多層印刷電路板 - Printed boards - rigid multilayer printed boards with interlayer connections - sectional specification - capability detail specification - performance levels , a , b and c
印制電路板.層間連接剛性印制電路板.分規(guī)范.性能詳細(xì)規(guī)格. a , b和c級(jí)性能水平 - Printed boards - part 4 : rigid multilayer printed boards with interlayer connections - sectional specification - section 1 : capability detail specification - performance levels a , b and c
印制板.第4部分:層連接的剛性多層印制板.分規(guī)范.第1節(jié):性能詳細(xì)規(guī)范.性能水平a b和c - Printed boards . part 4 : rigid multilayer printed boards with interlayer connections . sectional specification . section 1 : capability detail specification performance levels a , b and c
印刷電路板.第4部分:層間連接件的剛性多層印刷電路板.第1節(jié):容量詳細(xì)規(guī)范性能等級(jí)a b和c - Printed boards - part 4 : rigid multilayer printed boards with interlayer connections ; sectional specification ; section 1 : capability detail specification ; performance levels a , b and c iec 62326 - 4 - 1 : 1996 ; german version en 62326 - 4 - 1 : 1997
印制電路板.第4部分:層間連接剛性多層印制電路板.分 - It's difficult to find rigid multilayer printed board in a sentence. 用rigid multilayer printed board造句挺難的
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