microprocesses中文什么意思

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用"microprocesses"造句

(microprocess 的復(fù)數(shù)) 微觀過程

microprocessing unit (mpu): The main constituent of the hardware of the microcomputer. It consists of the microprocessor, the main memory (composed of Read/Write and Read-only memory), the input/output interface devices, and the clock circuit, in addition to buffer, driver circuits, and passive circuit elements.; 微型計算機的主要硬件部分,包括微處理器、主存儲器(由讀寫及只讀存儲器組成)、輸入輸出接口裝置、時鐘電路以及緩沖器、驅(qū)動電路和無源電路元件。
microprocesser: v. 微處理器
microprocessing unit addressing mode: 微處理裝置定址模式
microprocessed sensing and automatic regulation: 微處理機程控傳感與自動調(diào)節(jié)
microprocessing unit interface: 微處理裝置介面

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the microprocesses of fracture in commercial purity metals ( fe, al, ti and mg ) were observed by in-suit tension in tem
在掃描電鏡中原位觀察球墨鑄鐵微微裂紋萌生與擴展過程，從而能更深入地探討斷裂的微觀機理。
as an example, optimum microstructures of ductile iron were designed according to the observations on the microprocesses of fracture in the last part of this thesis
本文最后根據(jù)球鐵斷裂微觀機理研究的結(jié)果，對球鐵進行優(yōu)化組織設(shè)計，以期顯著提高球鐵強韌性。
the micromechanisms of fracture in engineering materials have been studied in this thesis, with particular emphasis on the dislocations behavior in the front of crack tip and the processes of crack nucleation and propagation on nanometer scale . the relation between the microprocesses of fracture and the macromechanical behaviors were investigated, which will be helpful to the strengthening and toughening of engineering materials
本文首先對材料斷裂文獻進行綜述，了解斷裂微觀機理研究的過去成就、現(xiàn)狀和發(fā)展，確定本文研究的內(nèi)容為工程材料斷裂的微觀機理，側(cè)重裂尖微區(qū)位錯行為和納米尺度上微裂紋形核與擴展過程及微觀組織的影響，斷裂微觀過程與宏觀力學(xué)行為的關(guān)系，為工程材料的強韌化提供理論依據(jù)。
the microprocesses of deformation and fracture in 18-8 stainless steel were observed by in-situ tension in tem . it was found that the dislocations were emitted from the grainboundary and dislocation source inside a grain and slip along their slip system respectively . partial dislocation could also be emitted from the grainboundary, and moved into the grain, and that leaving behind a stacking fault
摘要浙江人學(xué)博1：學(xué)位論文采用透射電鏡動態(tài)拉伸、原位觀察icrlsnigti不銹鋼形變與斷裂過程，發(fā)現(xiàn)不銹鋼變形時，晶界和晶內(nèi)位錯源均可產(chǎn)生位錯，并沿各自的滑移系運動。

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microprocesses中文什么意思

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