- 電解遷移
- 電遷移法
- 電移
- 電子漂移
- electromigration immunity: 電遷移耐力
- electromigration injection: 電遷移進樣
- electromigration resistance: 電遷移耐力
- injection, electromigration: 電遷移進樣
- counter-current electromigration: 反電流徙動
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electromigration中文什么意思
- 電解遷移
- 電遷移法
- 電移
- 電子漂移
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例句與用法
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- Atoms in the solder joints move as a result of both diffusion and electromigration
另一方面，擴散和電遷移效應(yīng)，則造成焊點中的原子移動。 - As an electric current passes through , the joule heating and electromigration effects occur in the flip chip solder bumps
當(dāng)電流通過焊點時，會伴隨產(chǎn)生焦耳熱效應(yīng)和電遷移效應(yīng)。 - There are many aspects of power grid integrity analysis , for example , analysis of ir drop and analysis of electromigration
電源網(wǎng)格的完整性分析包含很多方面，如irdrop分析，金屬電遷移等。 - Standard test method for estimating electromigration median time - to - failure and sigma of integrated circuit metallizations metric
集成電路金屬噴鍍總量和電遷移中值失效時間的評定標(biāo)準(zhǔn)試驗方法 - In many issues of the reliability of copper interconnection , we place the emphasis on electromigration and stress migration
在銅互連可靠性的幾個主要問題中，重點針對互連中的電遷徙和應(yīng)力遷徙進行了探討。
百科釋義
Electromigration is the transport of material caused by the gradual movement of the ions in a conductor due to the momentum transfer between conducting electrons and diffusing metal atoms. The effect is important in applications where high direct current densities are used, such as in microelectronics and related structures.
詳細百科解釋