In this survey we explore the hardware aspects of reconfigurable computing machines , from single chip architecture to multichip systems , including internal structure and external coupling 在某一時刻一條指令執(zhí)行過程中整個處理器的部件都服務于盡快完成這條指令,至少在概念上如此。
Coverage ranges from thermal properties and semiconductor materials to mosfets , digital logic families , memory devices , microprocessors , digital - to - analog and analog - to - digital converters , digital filters , and multichip module technology 覆蓋范圍從熱性能和半導體材料的mosfet ,數(shù)字邏輯家庭,記憶體裝置,微處理器,數(shù)位類比和模擬到數(shù)字轉(zhuǎn)換器,數(shù)字濾波器,以及多芯片組件技術(shù)。
Multichip module ( mcm ) is high - level mode in electronic package . mcm is that bare dice and microelements are assembled on a high - density interconnection ( hdi ) substrate . mcm can meet the demands of compact packaging and high density 多芯片組件( mcm )是微電子封裝的高級形式,它是把裸芯片與微型元件組裝在同一個高密度布線基板上,組成能夠完成一定的功能的模塊甚至子系統(tǒng)。