The diffusion welding behavior of single - crystalline cu to single - crystalline - aio with a nb film interlayer and the joint microstructure properties were studied by tem , sem / eds analyses and four - point bend testing . the nb film interlayer deposited by electron beam evaporation on the ceramic side prior to diffusion welding was found to be olycrytalline and fiber - textured after diffusion bonding , with the close - packed plane ( 110 ) being parallel to the ( 0001 ) basal plane of - aio 擴散連接技術(shù)是一門邊緣科學(xué),涉及材料、擴散、相變、界面反應(yīng)、接頭應(yīng)力應(yīng)變等各種行為,工藝參數(shù)多,雖然已經(jīng)進行了大量的試驗研究,但卻對各種材料的連接機理尚未有明確的認識,為此人們試圖借助于計算技術(shù),對接頭行為進行數(shù)值模擬,以便找到共同規(guī)律,對擴散連接過程及質(zhì)量進行預(yù)測與實時控制。