silicon造句
- Now people can produce a wafer silicon .
現(xiàn)在人們能夠生產(chǎn)一種硅晶薄片。 - Silicon is usually added by co-evaporation .
硅通常是通過共蒸發(fā)來加入的。 - Total silicon loss can equal 50% at this step .
在這階段總的硅損失量達50。 - What uses will they find for a silicon chip ?
他們將為硅片找到什么樣的用途？ - Silicon is one of the most studied elements in the periodic table .
硅是周期表中最熟悉的元素之一。 - The pertinent siloxane compounds contain two silicon hydride bonds .
所說的硅氧烷組合物中，含有兩類硅氧鍵。 - The pertinent siloxane compounds contain two silicon hydride bonds .
所說的硅氧烷化合物中，含有兩類硅氧鍵。 - Inside the battery there are a number of disk made of the element silicon .
在電池內部，有一些用硅元素做成的圓盤。 - The cell contains two types of silicon spheres about as big as buckshot .
這種電池裝有兩種大約有頭號鉛彈那樣大的硅球。 - This dependence may be the result of phosphorous being segregated into the silicon .
這種依賴性可能是磷分凝在硅中的結果。 - It's difficult to see silicon in a sentence. 用silicon造句挺難的
- The method is to coat a wafer of silicon with a protective layer of silicon dioxide .
其方法是往硅片上涂上一層二氧化硅防護膜。 - Normal glass will slough off silicon that may stimulate high levels of production .
普通玻璃可能會使刺激高水平生產(chǎn)量的硅脫落。 - Silicon is a hard, brittle material registering 72. 6 on the rockwell "a" hardness scale .
硅是硬而脆的材料，根據(jù)Rockwell“A”硬度分度測值為726。 - The processing characteristics and some material properties of silicon wafers depend on the orientation .
硅片的工藝性質與某些材料特性均與晶向有關。 - Doped silicon and germanium are technologically the most important types of semiconducting material .
添加硅和鍺在工藝上是半導體物質中最重要的類型。 - Silicon and germanium, for instance, have forbidden bands whose widths are 1. 1 and 0. 65ev, respectively .
例如，硅和鍺的禁帶寬度分別為11電子伏和065電子伏。 - Upon cooling, the thermal mismatch between residual silicon and quartz usually results in the fracture of the crucible .
當冷卻時，殘余的硅和石英間的熱失配往往導致坩堝破裂。 - A way to circumvent the problem is to fabricate devices in small islands of silicon on an insulating substrate as shown in fig. 32 .
消除這個問題的一個方法是把器件制造在絕緣襯底的硅島上，如圖32所示。 - The final ic is made by sequentially transferring the features from each mask, level by level, to the surface of the silicon wafer .
按照順序從每一塊掩膜版上將圖形一層一層地轉移到硅片的表面，就制得了成品集成電路。 - Lithography, as used in the manufacture of ics, is the process of transferring geometic shapes on a mask to the surface of a silicon wafer .
光刻技術應用到集成電路制造中，就是將掩模版的幾何圖形轉移到硅片表面的工藝過程。
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