wafer造句
- Now people can produce a wafer silicon .
現(xiàn)在人們能夠生產(chǎn)一種硅晶薄片。 - Historically, wafers were waxed onto a metal plate .
過去片子是用石蠟固定到金屬板上。 - Personnel must wear proper clothing to protect the wafers .
工作人員必須穿適當(dāng)?shù)姆b以保護(hù)硅片。 - All organic and metallic residues on the wafers must be removed .
片子上所有的有機(jī)和金屬殘留物均必須清除。 - The dust produced during slicing weighs almost as much as the wafers .
在切割時(shí)所產(chǎn)生的碎屑幾乎和薄片一樣重。 - Large diameter wafers are feasible and 200-mm wafers have been produced .
大直徑片子已不難制造，200mm的片子也已產(chǎn)生了。 - The method is to coat a wafer of silicon with a protective layer of silicon dioxide .
其方法是往硅片上涂上一層二氧化硅防護(hù)膜。 - Laser making of wafers for identification purpose will also become a new attribute .
為了定位，片子上的激光標(biāo)記也將成為新的標(biāo)志。 - No food that i could dream of seemed half so utterly delicious as vanilla wafers .
我所夢(mèng)想的任何食物都不如香草薄餅?zāi)敲纯煽谟形丁?/li> - Sem stages are now available that can handle wafers 125 mm and larger in diameter .
現(xiàn)今已有能處理125mm和更大直徑的片子的SEM樣品臺(tái)。 - It's difficult to see wafer in a sentence. 用wafer造句挺難的
- A wafer of a moon was shining over gatsby's house, making the night fine as before .
一輪明月正照在蓋茨比別墅的上面使夜色跟先前一樣美好。 - The reactors for this type of deposition are easily scaled to accommodate 125-or 150-mm wafers .
這種淀積反應(yīng)器很容易達(dá)到適應(yīng)125或150mm的基片。 - The processing characteristics and some material properties of silicon wafers depend on the orientation .
硅片的工藝性質(zhì)與某些材料特性均與晶向有關(guān)。 - After completely processed wafers are tested, those chips that pass the tests are ready to be packaged .
全部工藝完成后，片子要進(jìn)行測(cè)試，合格的片子便去封裝。 - In one variant of this process the bumps are etched onto the tape rather than deposited on the wafer .
這種工藝有一種方式是，凸出物被蝕刻在帶上，而不是沉淀在硅片上。 - The major advantages of these reactions are excellent uniformity, large load size, and ability to accommodate large diameter wafers .
這種反應(yīng)器的主要優(yōu)點(diǎn)是優(yōu)越的均勻性，較大的負(fù)載量及適應(yīng)大直徑基片的能力。 - The final ic is made by sequentially transferring the features from each mask, level by level, to the surface of the silicon wafer .
按照順序從每一塊掩膜版上將圖形一層一層地轉(zhuǎn)移到硅片的表面，就制得了成品集成電路。 - Lithography, as used in the manufacture of ics, is the process of transferring geometic shapes on a mask to the surface of a silicon wafer .
光刻技術(shù)應(yīng)用到集成電路制造中，就是將掩模版的幾何圖形轉(zhuǎn)移到硅片表面的工藝過程。 - Polished wafers are subjected to a number of measurements that are concerned with cosmetic, crystal perfection, mechanical, and electrical attributes .
拋光好的片子還要進(jìn)行許多測(cè)試，如外觀，晶體完整性，以及力學(xué)和電學(xué)性質(zhì)。 - Ultrathin wafer level chip size package technology
超薄型圓片級(jí)芯片尺寸封裝技術(shù)
手機(jī)版